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Cu

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Product Overview
Catalog No:
CU0001
Inventory:
In-stock
Unit Size:
10 kg/15 kg
Sphericity Degree:
≥0.9
Form:
Subspherical powder
Preservation Condition:
Store tightly at room temperature and away from fire
Size:
20-63 μm
15-53 μm
45-106 μm
Custom particle size available
Density, g/cm3:
Apparent density: ≥1.4
Tap density: ≥1.6
Elements, wt.%:
Cu: Bal
Sn: 0.01
Si: <0.01
Cr: <0.01
Fe: <0.105
Mn: <0.01
Pb: <0.02
O: <0.08
N: <0.05
Tensile Strength, MPa:
300
Yield Strength, MPa:
250
Elongation, %:
38
Hardness:
HV/HRC: ≥45 HV5/15
Description:
Cu is a pure copper 3D printing material with excellent electrical and thermal conductivity, corrosion resistance, and ductility. Cu can be used to produce copper structural parts with complex structures, which can be used in electrical, mechanical manufacturing, aerospace, national defense and other fields.
For research use only, not intended for any clinical use.
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